TeraFlash smart

• 0.1–4.5 THz spectral range
• Up to 2,000 waveforms/s
• ECOPS technology with electronic delay
• No mechanical delay line
• Typical probing depth 10–100 mm
• High dynamic range up to 80 dB
• Robust all-fiber design for industrial environments

The TeraFlash smart is TOPTICA’s ultrafast time-domain terahertz spectroscopy platform, purpose-built for high-speed industrial and scientific applications. Based on TOPTICA’s proprietary ECOPS technology (Electronically Controlled Optical Sampling), it employs two synchronized femtosecond lasers and eliminates the need for a mechanical delay line. This innovative design ensures robust operation, minimal maintenance, and reliable performance even under adverse ambient conditions.

Thanks to this architecture, the TeraFlash smart achieves measurement speeds of up to 2,000 complete terahertz waveforms per second while maintaining a wide bandwidth and a high dynamic range. Such ultrafast data acquisition makes it uniquely suited for non-contact thickness gauging, resolving layer thicknesses down to the micrometer regime. Another application scenario is quality control on rapidly moving samples, from conveyor belts to polymer extrusion lines and papermaking machines, where conventional THz systems cannot keep pace.

The “Dual” version enables simultaneous measurements with two emitter-receiver pairs, enhancing the throughput and boosting flexibility in industrial process monitoring.

Combining compact design, fiber-coupled flexibility, and industry-leading speed, the TeraFlash smart redefines what is possible in terahertz inspection and analysis. It offers customers a reliable, future-ready platform for real-time process monitoring and advanced material research.

System Type: Time-Domain Terahertz Platform
Laser Wavelength: 1560 nm
Pulse Width: ~80 fs
Repetition Rate: 80 MHz
Spectral Range: 0.1–4.5 THz
Scan Range: 150 / 300 / 700 ps
Scan Speed: Up to 1,600 traces/s*
THz Power: ~30 µW
Dynamic Range: Up to 80 dB
Frequency Resolution: <1.5 GHz
Interface: Ethernet / USB

*Up to 2,000 waveforms/s is stated on the current product page; detailed specifications vary with configuration and scan range.

• Non-Contact Thickness Measurement
• Paint & Coating Inspection
• Semiconductor Inspection & Metrology
• Plastic & Composite Inspection
• Terahertz Imaging
• Non-Destructive Testing (NDT)
• Real-Time Industrial Process Monitoring